Meet Boyd at Data Center World London — Booth #C193

Chip-to-Ambient™ Thermal Solutions for High‑Density Data Center Architectures 

As data centers evolve to support AI, HPC, and ultra‑dense GPU workloads, traditional cooling limits performance, efficiency, and scalability. Boyd delivers liquid cooling solutions engineered to support high rack densities, enhance energy efficiency, and ensure thermal performance for next-generation data center architecture.  

At DCW London, explore how Boyd enables AI-ready data centers across Europe through proven liquid cooling technologies designed for both retrofit deployments and greenfield facilities.

Visit us at booth #C193 to explore the latest solutions supporting Europe’s AI expansion demands.  

Event Details:

Event: Data Center World London 

Location: ExCeL London 

When: March 4-5 

Visit Boyd at: Booth #C193